Sec. 4. In authorizing the issuance of bonds for any building facility or facilities, the board of the issuing state educational institution may: (1) limit the amount of bonds that may be issued as a first lien and charge against the property, fees, income, and funds; and (2) provide, after the original issuance of bonds, for the issuance of additional bonds secured by the same lien to provide funds to: (A) pay the cost of acquiring, erecting, constructing, reconstructing, improving, rehabilitating, remodeling, repairing, completing, extending, enlarging, equipping, or furnishing the building facility or facilities for which the original bonds were issued; (B) provide funds to pay the cost of additional building facilities under this article; or (C) perform actions under both clauses (A) and (B). [Pre-2007 Higher Education Recodification Citation: 20-12-6-6(c).]
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